EP1SGX25DF672C6

IC FPGA 455 I/O 672FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
CD23A0-DS
Manufacturer
Manufacturer Part #
EP1SGX25DF672C6

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570 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
672-BBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseFBGA-672
SeriesStratix GX
Number of I/ Os455
Mounting StyleSMD/SMT
Operating Supply Voltage1.5 V to 3.3 V
Maximum Operating Frequency650 MHz
PackagingTray
Minimum Operating Temperature0 C
Maximum Operating Temperature+ 70 C
Number of Logic Blocks2566
Distributed R A M1.9 Mbit

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The EP1SGX25DF672C6 is an Integrated Circuit (IC) component manufactured by Intel Corporation. This Field Programmable Gate Array (FPGA) provides high-performance processing capabilities for various applications. Here are some key features of this IC component: 1. FPGA Architecture: The EP1SGX25DF672C6 is built on a Stratix IV GX FPGA architecture, which offers advanced programmable logic resources and high-speed serial transceiver channels. 2. Logic Capacity: This FPGA component has a logic capacity of 25,788 KLE (Kilo-Laboratory Engines). KLE is a measure of the number of logic elements available in the FPGA, indicating the complexity of the logic designs it can handle. 3. Transceiver Channels: It supports up to 48 high-speed transceiver channels capable of transferring data at rates up to 6.375 Gbps. These transceivers are essential for applications that require fast data communication. 4. Embedded Memory: The EP1SGX25DF672C6 includes various types of embedded memory blocks, such as M144K memory blocks, MLAB memory, and distributed memory. These memory resources are important for storing data and implementing complex algorithms efficiently. 5. Process Technology: This component is manufactured using Intel's 40nm process technology. The smaller process node provides higher performance, lower power consumption, and improved reliability compared to larger process technologies

In Stock: 570

MOQ
1PCS
Packaging
672-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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