5SGXMB6R3F43I3LN

IC FPGA 600 I/O 1760FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
7DFF69-DS
Manufacturer
Manufacturer Part #
5SGXMB6R3F43I3LN

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79 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1760-BBGA, FCBGA

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-FBGA, FC (42.5x42.5)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O600
Number of L A Bs/ C L Bs225400
Number of Logic Elements/ Cells597000
Total R A M Bits53248000
SeriesStratix® V GX
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGXMB6R3F43I3LN is an Integrated Circuit (IC) component manufactured by Intel Corporation. It belongs to the Stratix V GX series and is specifically designed for high-performance applications such as data center acceleration, military-grade systems, and wireline communication equipment. Here is an overview along with its key features: Overview: The 5SGXMB6R3F43I3LN is a Field Programmable Gate Array (FPGA) chip that offers advanced programmable logic, diverse high-speed transceivers, and embedded memory blocks. It provides designers with the flexibility to customize the functionality of the IC according to specific application requirements. Key Features: 1. Advanced Logic Architecture: The component features Intel's high-performance logic fabric that allows the IC to deliver high-speed performance while facilitating efficient power consumption. It includes adaptive logic modules, embedded registers, and digital signal processing (DSP) blocks. 2. Large Capacity: The 5SGXMB6R3F43I3LN offers a large programmable capacity, enabling the implementation of complex designs. It contains approximately 622,080 logic elements, allowing for the integration of multiple functions on a single chip. 3. High-Speed Transceivers: The IC includes 43 high-speed transceivers that support various protocols, including PCI Express, 10 Gigabit Ethernet, Serial RapidIO, and more. These transceivers provide high-bandwidth connectivity options for interfacing with external devices

In Stock: 79

MOQ
1PCS
Packaging
1760-BBGA, FCBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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