5SGXMABN3F45I3N

IC FPGA 840 I/O 1932FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
7B3045-DS
Manufacturer
Manufacturer Part #
5SGXMABN3F45I3N

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76 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1932-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case1932-BBGA, FCBGA
Supplier Device Package1932-FBGA, FC (45x45)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O840
Number of L A Bs/ C L Bs359200
Number of Logic Elements/ Cells952000
Total R A M Bits53248000
SeriesStratix® V GX
Base Product Number5SGXMAB
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component 5SGXMABN3F45I3N is a field-programmable gate array (FPGA) manufactured by Intel. It is part of the Intel Stratix 5 series, which is known for its high-performance, low-power capabilities. The 5SGXMABN3F45I3N model specifically offers advanced features and functionalities suitable for various applications. Key Features: 1. FPGA Architecture: The 5SGXMABN3F45I3N features an advanced FPGA architecture, allowing users to program and reconfigure the device to meet their specific needs. It offers high logic density and performance capabilities. 2. High-Speed Interfaces: This component supports a range of high-speed interfaces, including multiple gigabit transceivers, low-voltage differential signaling (LVDS), and other high-speed I/O standards. Such interfaces enable reliable and efficient communication with external devices and systems. 3. Logic Elements: With a significant number of logic elements, the 5SGXMABN3F45I3N allows for complex and versatile digital circuit designs. These logic elements provide the building blocks for implementing various functions and algorithms within the FPGA. 4. Embedded Memory: The component includes embedded memory blocks, such as dual-port RAMs and FIFOs, enabling efficient storage and retrieval of data. These memory blocks can be customized and partitioned based on the specific requirements of the application

In Stock: 76

MOQ
1PCS
Packaging
1932-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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