5SGXMA5K2F40C3WN

IC FPGA 696 I/O 1517FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
6F8A56-DS
Manufacturer
Manufacturer Part #
5SGXMA5K2F40C3WN

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60 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FBGA (40x40)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O696
Number of L A Bs/ C L Bs185000
Number of Logic Elements/ Cells490000
Total R A M Bits46080000
SeriesStratix® V GX
Base Product Number5SGXMA5
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating4 (72 Hours)
US ECCNOBSOLETE
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGXMA5K2F40C3WN is an Integrated Circuit (IC) component developed by Intel Corporation. It belongs to the Intel Stratix 5 family and offers advanced system-on-chip (SoC) capabilities. Below is an overview of this IC component along with its key features: Overview: - The 5SGXMA5K2F40C3WN is a highly versatile and high-performance FPGA (Field-Programmable Gate Array) that integrates several technologies to provide enhanced processing capabilities. - This IC component is built on Intel's 28nm process technology, which ensures efficient power consumption and high computational performance. - It incorporates high-density programmable logic blocks, embedded memory, and a wide range of high-speed I/O interfaces. - The 5SGXMA5K2F40C3WN offers flexible configuration options that allow designers to customize the device according to their specific application requirements. Key Features: 1. Programmable Logic: - The 5SGXMA5K2F40C3WN features approximately 5.2 million (5,200,000) logic elements, offering significant resources for implementing complex digital circuits. - These logic elements can be customized to perform a wide variety of functions, making it suitable for diverse applications. 2. Embedded Memory: - The IC component consists of up to 380 megabits (Mb) of embedded memory, enabling efficient implementation of large-scale data storage and processing modules

In Stock: 60

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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