5SGXEBBR3H43I3L

IC FPGA 600 I/O 1760HBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
AA1381-DS
Manufacturer
Manufacturer Part #
5SGXEBBR3H43I3L

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

2832 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1760-BBGA, FCBGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Package / CaseBGA-1760
SeriesStratix V GX
Number of I/ Os600
Mounting StyleSMD/SMT
PackagingTray
Minimum Operating Temperature- 40 C
Maximum Operating Temperature+ 85 C
Number of Logic Blocks2640
Distributed R A M52 Mbit

Kindly contact our sales Rep to obtain the data you desire for 5SGXEBBR3H43I3L.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The IC component 5SGXEBBR3H43I3L, part of the Intel Stratix 5 series, is a highly advanced programmable logic device (PLD) designed to offer high-performance processing and integration capabilities. It incorporates a wide range of features that make it suitable for various applications, including high-end industrial machinery, telecommunications infrastructure, data centers, and more. Here are some key features of the 5SGXEBBR3H43I3L: 1. FPGA Architecture: The component utilizes a Field Programmable Gate Array (FPGA) architecture, providing a flexible and reconfigurable platform for designers to implement customized digital circuits and perform complex computations. 2. High Logic Density: The 5SGXEBBR3H43I3L offers a significant logic density, allowing designers to implement large-scale designs with extensive digital circuitry, including processors, memory interfaces, and high-speed communication interfaces. 3. Advanced Memory Interfaces: The device supports industry-standard memory interfaces such as DDR3, DDR4, QDR II+, RLDRAM III, and QDRII+ to facilitate efficient data storage and retrieval. 4. High-Speed Interfaces: It incorporates multiple transceivers operating at various high speeds, including up to 12.5 Gbps, to enable rapid data transfer and communication between different components or systems

In Stock: 2832

MOQ
1PCS
Packaging
1760-BBGA, FCBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04