5SGXEA3H2F35C2L

IC FPGA 432 I/O 1152FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
30EED0-DS
Manufacturer
Manufacturer Part #
5SGXEA3H2F35C2L

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81 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA (35x35)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O432
Number of L A Bs/ C L Bs128300
Number of Logic Elements/ Cells340000
Total R A M Bits19456000
SeriesStratix® V GX
Base Product Number5SGXEA3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGXEA3H2F35C2L is an Integrated Circuit (IC) component developed by Intel, specifically designed for high-performance applications such as telecommunications, video processing, industrial automation, and more. Here are the key features of this IC component: 1. FPGA Architecture: The 5SGXEA3H2F35C2L is built on Intel's Stratix V family of Field-Programmable Gate Arrays (FPGAs). FPGAs offer a unique advantage as they can be programmed and reprogrammed to perform specific functions, making them highly versatile. 2. Logic Capacity: It offers a logic capacity of 346,080 LEs (Logic Elements), allowing for complex designs and high-density implementations. 3. High-Speed Transceivers: The IC includes up to 36 backplane-capable serial transceivers operating at data rates of up to 12.5 Gbps. These transceivers enable high-speed data communication and can be utilized in various applications that require fast data transfer. 4. Embedded Memory: It incorporates 12.3 Mbits of embedded memory, which allows for efficient data storage and retrieval within the chip itself, reducing the need for external memory components. 5. DSP Blocks: The 5SGXEA3H2F35C2L includes 960 embedded 18 x 18-bit multipliers, known as Digital Signal Processing (DSP) blocks

In Stock: 81

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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