5SGSMD4E1H29C2L

IC FPGA 360 I/O 780HBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
B7BD5F-DS
Manufacturer
Manufacturer Part #
5SGSMD4E1H29C2L

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

35 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-HBGA (33x33)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O360
Number of L A Bs/ C L Bs135840
Number of Logic Elements/ Cells360000
Total R A M Bits19456000
SeriesStratix® V GS
Base Product Number5SGSMD4
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for 5SGSMD4E1H29C2L.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The 5SGSMD4E1H29C2L is a high-performance integrated circuit (IC) component belonging to the Stratix V family of field-programmable gate arrays (FPGAs) manufactured by Intel. This FPGA offers a plethora of features and capabilities suited for a wide range of applications. Here's a summary of its key features: 1. FPGA Architecture: The 5SGSMD4E1H29C2L utilizes Intel's 28 nm Tri-Gate process technology, enabling it to deliver excellent performance, high logic density, and efficient power consumption. 2. Logic Elements (LEs): This FPGA provides a substantial number of LEs, which are the basic building blocks for implementing digital logic and computation in the device. The 5SGSMD4E1H29C2L offers up to 477,520 LEs, allowing for complex and sophisticated designs. 3. Embedded Memory: It incorporates various memory blocks, including M20K memory blocks optimized for high-speed and dual-port RAM requirements, high-capacity MLAB memory blocks, and DLAB memory blocks for digital signal processing (DSP) functions. These memory blocks enhance overall performance and increase data storage capabilities. 4. High-Speed Transceivers: The 5SGSMD4E1H29C2L features up to 36 high-speed transceivers operating at data rates of up to 14.1 Gbps

In Stock: 35

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04

Consultation