5SGSMD3H2F35C2L

IC FPGA 432 I/O 1152FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
D93665-DS
Manufacturer
Manufacturer Part #
5SGSMD3H2F35C2L

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80 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA (35x35)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O432
Number of L A Bs/ C L Bs89000
Number of Logic Elements/ Cells236000
Total R A M Bits13312000
SeriesStratix® V GS
Base Product Number5SGSMD3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component 5SGSMD3H2F35C2L is a Field Programmable Gate Array (FPGA) device manufactured by Intel (formerly Altera). Here is an overview of its key features: 1. FPGA Architecture: The 5SGSMD3H2F35C2L is built on Intel's Stratix V architecture, which offers a high-performance platform for implementing complex digital systems. It provides a hardware reconfigurable logic fabric that allows users to program the device according to their application requirements. 2. Logic Elements: This FPGA offers a generous number of logic elements (LEs) with a capacity of around 206,000. LEs are the basic building blocks of an FPGA and consist of look-up tables (LUTs), registers, and other customizable logic resources. They can be used to implement functions, mathematical operations, and control circuits. 3. Programmable Interconnect: The device features a highly configurable interconnect network that allows users to establish connections between different logic elements. It enables efficient data routing and provides flexibility in designing complex digital circuits. 4. High-Speed Transceivers: The 5SGSMD3H2F35C2L includes 12 full-duplex transceivers with data rates up to 10 Gbps. These high-speed transceivers enable the device to interface with various external components, such as memory modules, processors, or other communication interfaces

In Stock: 80

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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