5AGZME7H2F35I3LN

IC FPGA 534 I/O 1152FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
C99376-DS
Manufacturer
Manufacturer Part #
5AGZME7H2F35I3LN

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36 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA (35x35)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O534
Number of L A Bs/ C L Bs21225
Number of Logic Elements/ Cells450000
Total R A M Bits40249344
SeriesArria V GZ
Base Product Number5AGZME7
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
IC component 5AGZME7H2F35I3LN is a sophisticated integrated circuit that offers advanced features and capabilities. It belongs to a specific family or series of IC components, and the detailed information about this particular component is not readily available. However, I can provide a generic overview of key features that are commonly found in modern IC components: 1. High-performance processing: The 5AGZME7H2F35I3LN is designed to deliver high-speed processing capabilities, enabling it to handle complex tasks efficiently. 2. Multifunctionality: IC components often integrate multiple functions into a single chip, such as logic, memory, or programmable features. This allows for compact form factors and reduces the need for external components. 3. Programmability: Many IC components are programmable, meaning they can be configured to perform specific tasks or adapt to various applications. This flexibility allows for customization and optimization for different use cases. 4. Low power consumption: In today's energy-conscious world, IC components strive to minimize power consumption. This not only extends battery life but also reduces heat dissipation and overall energy costs. 5. High integration: The 5AGZME7H2F35I3LN likely offers a high level of integration, incorporating various functionalities within a single component. This integration can enhance performance, reduce complexity, and optimize overall system design

In Stock: 36

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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