5AGZME3H2F35C3N

IC FPGA 414 I/O 1152FBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
5B224C-DS
Manufacturer
Manufacturer Part #
5AGZME3H2F35C3N

Customer Reference

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65 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1152-BBGA, FCBGA Tray

Quantity

Get pricing info from knowledgeable sales

ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case1152-BBGA, FCBGA
Supplier Device Package1152-FBGA (35x35)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O414
Number of L A Bs/ C L Bs16980
Number of Logic Elements/ Cells360000
Total R A M Bits23946240
SeriesArria V GZ
Base Product Number5AGZME3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component 5AGZME3H2F35C3N is a sophisticated and versatile integrated circuit that offers several key features. Here is an overview: 1. High Performance: This IC component is designed to deliver exceptional performance in various applications. It offers a combination of speed, accuracy, and efficiency to meet the requirements of demanding electronic systems. 2. Low Power Consumption: The 5AGZME3H2F35C3N is optimized for low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. It helps to conserve energy and extend battery life. 3. Programmability: One of the standout features of this IC is its programmability. It provides a flexible platform that allows users to configure and customize its behavior according to their specific needs. This adaptability makes it suitable for a wide range of applications. 4. High Integration: The IC component offers a high level of integration, packing multiple functions into a single chip. It includes various components like logic gates, memory elements, analog-to-digital converters, and more. This integration simplifies circuit design, reduces board space, and enhances overall system performance. 5. Advanced Communication Interfaces: The 5AGZME3H2F35C3N comes equipped with advanced communication interfaces, such as UART, SPI, I2C, and CAN. These interfaces facilitate seamless communication and data transfer between the IC component and other devices or systems

In Stock: 65

MOQ
1PCS
Packaging
1152-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
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