5AGZME3E3H29I4N

IC FPGA 342 I/O 780HBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
8D642B-DS
Manufacturer
Manufacturer Part #
5AGZME3E3H29I4N

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41 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
780-BBGA, FCBGA Tray

Quantity

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ManufacturerIntel Corporation
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case780-BBGA, FCBGA
Supplier Device Package780-HBGA (33x33)
Voltage - Supply0.82V ~ 0.88V
Number of I/ O342
Number of L A Bs/ C L Bs16980
Number of Logic Elements/ Cells360000
Total R A M Bits23946240
SeriesArria V GZ
Base Product Number5AGZME3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
MSL Rating3 (168 Hours,30°C/60%RH)
US ECCN3A001A2C
HTS US8542.39.0001
REACH StatusVendor is not defined
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The IC component with the name 5AGZME3E3H29I4N belongs to a specific product series or model, and unfortunately, there is no publicly available information regarding this specific component with those exact markings. However, I can provide you with a general overview of IC components and their key features. Overview: Integrated Circuit (IC) components are miniature electronic circuits fabricated on a small chip of semiconductor material. These components are widely used in various electronic devices due to their compactness, reliability, and ability to perform complex functions. IC components can be categorized into different types based on their functionality, such as microprocessors, memory chips, amplifiers, sensors, and many more. Key Features (General IC Component Features): 1. Miniaturization: IC components are exceptionally small in size, allowing for higher integration and more compact designs. 2. Complexity: They can contain thousands, millions, or even billions of transistors and other electronic components on a single chip. 3. Integrated Functionality: IC components can perform a wide range of functions, including data processing, memory storage, signal amplification, analog-to-digital conversion, and many more. 4. Low Power Consumption: IC components are designed to operate using minimal power, making them energy-efficient and suitable for portable devices. 5. Reliability: Due to their monolithic construction and automated fabrication processes, IC components tend to have high reliability and consistent performance

In Stock: 41

MOQ
1PCS
Packaging
780-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
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