CYW15G0401DXB-BGC

IC TELECOM INTERFACE 256BGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
39B7E0-DS
Manufacturer Part #
CYW15G0401DXB-BGC

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72 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
256-BGA Exposed Pad Tray

Quantity

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ManufacturerInfineon Technologies
Integrated Circuits (ICs)Telecom Interface
Product StatusObsolete
Operating Temperature0°C ~ 70°C
Mounting TypeSurface Mount
Package / Case256-BGA Exposed Pad
Current - Supply830mA
FunctionsTransceiver
InterfaceLVTTL
Supplier Device Package256-L2BGA (27x27)
Number of Circuits4
Voltage - Supply3.135V ~ 3.465V
SeriesHOTlink II™
Base Product NumberCYW15G0401
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS non-compliant
MSL Rating3 (168 Hours,30°C/60%RH)
REACH StatusREACH Unaffected
US ECCN5A991B1
HTS US8542.39.0001
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The CYW15G0401DXB-BGC is an IC (integrated circuit) component developed by Cypress Semiconductor Corporation. It is a wireless connectivity module that combines Bluetooth Low Energy (BLE) and IEEE 802.15.4 wireless technologies. Here are the key features of this IC component in a brief overview: 1. Wireless Connectivity: The CYW15G0401DXB-BGC supports multiple wireless communication technologies, including Bluetooth Low Energy (BLE) and IEEE 802.15.4. This enables it to connect and transfer data with various devices and networks. 2. Dual MAC Architecture: The IC features a dual MAC architecture that supports simultaneous operation of BLE and 802.15.4 networks. This allows for efficient coexistence between different wireless protocols without interference or performance degradation. 3. Ultra-Low Power Consumption: The CYW15G0401DXB-BGC is optimized for ultra-low power operation, making it suitable for battery-powered applications. It leverages power-saving techniques to minimize energy consumption without sacrificing performance. 4. Rich Set of Interfaces: The IC offers a wide range of interfaces, including UART (Universal Asynchronous Receiver-Transmitter), SPI (Serial Peripheral Interface), I2C (Inter-Integrated Circuit), and GPIO (General-Purpose Input/Output). These interfaces facilitate easy integration with other components and peripherals

In Stock: 72

MOQ
1PCS
Packaging
256-BGA Exposed Pad Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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