XCZU3EG-L2SFVC784E

IC SOC CORTEX-A53 784FCBGA
part number has RoHS
1 : $1809.6000

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Dasenic Part Number
31094B-DS
Manufacturer
Manufacturer Part #
XCZU3EG-L2SFVC784E

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633 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
784-BFBGA, FCBGA Tray
Quantity
Unit Price
$ 1809.6
Total
$ 1809.6

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature0°C ~ 100°C (TJ)
Package / Case784-BFBGA, FCBGA
Supplier Device Package784-FCBGA (23x23)
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
Number of I/ O252
Speed533MHz, 600MHz, 1.3GHz
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
R A M Size256KB
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesZynq®UltraScale+™ FPGA, 154K+ Logic Cells
SeriesZynq® UltraScale+™ MPSoC EG
Base Product NumberXCZU3
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating4 (72 Hours)
REACH StatusREACH Unaffected
US ECCN5A002A4 XIL
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCZU3EG-L2SFVC784E is an integrated circuit (IC) component developed by Xilinx. It belongs to the Zynq UltraScale+ family, specifically targeting the EG series. This IC features a range of advanced capabilities and is commonly utilized in various applications, such as automotive, networking, aerospace, and industrial sectors. Below is an overview of the key features of this IC component. 1. Processing System: The XCZU3EG-L2SFVC784E incorporates a powerful processing system, combining a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 processor. This setup enables efficient and responsive processing, facilitating tasks such as real-time control and data processing. 2. Programmable Logic: This IC integrates programmable logic employing Xilinx's FPGA (Field-Programmable Gate Array) technology. The FPGA fabric empowers users to customize hardware functions, enabling the IC to address diverse application demands. It offers immense flexibility and adaptability, making it suitable for various use cases. 3. UltraScale+ Architecture: The IC is built on the UltraScale+ architecture by Xilinx, which brings optimizations in terms of performance, power efficiency, and integration. It leverages advanced 16nm FinFET+ process technology, providing higher speed and lower power consumption. 4. On-Chip Memory: It includes a generous amount of on-chip memory to facilitate fast and efficient data handling. This consists of 4.5MB of total block RAM and 150MB of UltraRAM, enabling high-speed data storage and retrieval. 5. High-Speed Connectivity: The XCZU3EG-L2SFVC784E offers a wide range of high-speed connectivity options. It features four multi-gigabit transceivers supporting protocols like PCIe, SATA, and USB3.0, enabling robust data transfer capabilities. Additionally, it provides a plethora of Gigabit Ethernet ports for reliable networking functionality. 6. Versatile IO Interfaces: The IC is equipped with an array of IO interfaces, ensuring compatibility with various external devices and systems. It includes numerous UART, SPI, I2C, and GPIO interfaces, allowing seamless communication with sensors, displays, and other peripherals. 7. Video and Image Processing: With built-in video codec units, this IC simplifies video and image processing tasks. It supports video standards like HDMI, MIPI CSI-2, and DisplayPort, making it suitable for multimedia applications, including video surveillance, digital signage, and automotive infotainment. 8. Security Features: To safeguard critical data and intellectual property, the XCZU3EG-L2SFVC784E incorporates robust security mechanisms. It includes cryptographic accelerators, secure boot, and tamper-resistant bitstream encryption, bolstering the overall system's security. In summary, the XCZU3EG-L2SFVC784E IC component encompasses an array of powerful features, including an advanced processing system, programmable logic, high-speed connectivity, versatile IO interfaces, video processing capabilities, on-chip memory, and robust security. These features make it an ideal solution for a wide range of application domains, where performance, flexibility, and system integration are key requirements.

In Stock: 633

MOQ
1PCS
Packaging
784-BFBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 1809.6
Total
$ 1809.6

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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