XCZU19EG-2FFVC1760I

IC SOC CORTEX-A53 1760FCBGA
part number has RoHS
1 : $20620.0000

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Dasenic Part Number
5A6D24-DS
Manufacturer
Manufacturer Part #
XCZU19EG-2FFVC1760I

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1035 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1760-BBGA, FCBGA Tray
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-FCBGA (42.5x42.5)
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
Number of I/ O512
Speed533MHz, 600MHz, 1.3GHz
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
R A M Size256KB
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesZynq®UltraScale+™ FPGA, 1143K+ Logic Cells
SeriesZynq® UltraScale+™ MPSoC EG
Base Product NumberXCZU19
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating4 (72 Hours)
REACH StatusREACH Unaffected
US ECCN5A002A4 XIL
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCZU19EG-2FFVC1760I is a highly advanced IC (Integrated Circuit) component developed by Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family and offers exceptional performance and versatility for a wide range of applications. Let's dive into some key features and an overview of this IC component. The XCZU19EG-2FFVC1760I is built on a 16nm FinFET+ process technology, enabling it to deliver excellent performance with low power consumption. It integrates a combination of processing system (PS) and programmable logic (PL) to provide a heterogeneous computing platform. This allows users to implement a diverse range of functions and tailor the IC for specific application requirements. Here are the key features of the XCZU19EG-2FFVC1760I: 1. Processing System (PS): The IC is equipped with a quad-core Arm Cortex-A53 application processor running at a maximum frequency of 1.5GHz. Along with the application processor, it includes dual-core Arm Cortex-R5 real-time processors operating at up to 600MHz. The PS also incorporates various peripherals like USB, Ethernet, UART, I2C, SPI, and more. 2. Programmable Logic (PL): The PL portion of the IC consists of Xilinx's programmable fabric, which provides a vast array of configurable digital logic resources. It includes programmable logic blocks, configurable I/Os, digital signal processing (DSP) slices, memory interfaces, PCIe controllers, and more. The PL allows users to implement custom hardware accelerators and perform specialized computations efficiently. 3. Arm Mali??400MP2 GPU: This IC component incorporates a dual-core Arm Mali??400MP2 GPU, which offers powerful graphics processing capabilities. It enables the acceleration of graphics-intensive applications and GUI rendering, making it suitable for applications like human-machine interfaces, gaming, and multimedia. 4. Memory and Storage: The XCZU19EG-2FFVC1760I provides various memory options, including up to 4GB of DDR4 memory for the PS, low-power DDR4 for the PL, and QSPI flash memory for storing boot images and configuration data. 5. High-Speed Interfaces: The IC offers an extensive range of high-speed interfaces, including PCI Express Gen2/3, USB 3.0, Gigabit Ethernet, SATA, DisplayPort, HDMI, and more. These interfaces enable fast and efficient data transfer between the IC and external devices. 6. Specialized Processing Units: The XCZU19EG-2FFVC1760I includes specialized processing units like Programmable Real-Time Units (PRTUs), Floating-Point Units (FPUs), and fixed-point digital signal processing (DSP) slices. These units accelerate specific operations such as real-time control, high-speed computation, and signal processing. Overall, the XCZU19EG-2FFVC1760I is a highly integrated and powerful IC component that combines processing capabilities, programmable logic, and a rich set of features. It offers significant flexibility for designing complex applications across various domains like embedded vision, industrial automation, automotive, aerospace, and more.

In Stock: 1035

MOQ
1PCS
Packaging
1760-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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Payment
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