XCZU19EG-2FFVB1517E

IC SOC CORTEX-A53 1517FCBGA
part number has RoHS
1 : $15035.0000

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Dasenic Part Number
5AA2FC-DS
Manufacturer
Manufacturer Part #
XCZU19EG-2FFVB1517E

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833 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA Tray
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature0°C ~ 100°C (TJ)
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FCBGA (40x40)
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
Number of I/ O644
Speed533MHz, 600MHz, 1.3GHz
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
R A M Size256KB
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesZynq®UltraScale+™ FPGA, 1143K+ Logic Cells
SeriesZynq® UltraScale+™ MPSoC EG
Base Product NumberXCZU19
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating4 (72 Hours)
REACH StatusREACH Unaffected
US ECCN5A002A4 XIL
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCZU19EG-2FFVB1517E is an advanced programmable system-on-chip (SoC) integrated circuit (IC) manufactured by Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers high-performance processing capabilities along with programmable logic to cater to a wide range of applications. Key Features: 1. Processing System: The XCZU19EG-2FFVB1517E includes a quad-core Arm Cortex-A53 processor with a clock speed of up to 1.5 GHz. This processing system provides the ability to execute multiple tasks simultaneously, enabling efficient and powerful computation. 2. Programmable Logic: The IC integrates Xilinx's programmable logic, allowing users to implement custom digital designs tailored to their specific application requirements. The programmable logic resources include configurable logic blocks (CLBs), digital signal processing (DSP) slices, and block RAMs, providing flexibility and adaptability. 3. UltraScale+ Architecture: The XCZU19EG-2FFVB1517E incorporates Xilinx's UltraScale+ architecture, which offers enhanced performance, lower power consumption, and higher system integration compared to previous generations. This architecture equips the IC with high-speed transceivers, PCIe Gen3/Gen4 interfaces, and Gigabit Ethernet connectivity. 4. Memory Interfaces: The IC supports various memory interfaces to facilitate efficient data storage and retrieval. It provides DDR4 and LPDDR4 memory support with a maximum data rate of 2400 Mbps, allowing for high-speed and large-capacity memory access. 5. High-Speed I/Os: The XCZU19EG-2FFVB1517E features a substantial number of high-speed I/O interfaces, including multi-gigabit transceivers (MGTs) and general-purpose input/output (GPIO) pins. These interfaces enable seamless integration with external devices and peripherals, ensuring efficient data exchange. 6. Connectivity: The IC provides a diverse range of connectivity options, including USB 3.0, 10/100/1000 Ethernet, and SD/SDIO interfaces. These interfaces enable easy communication with various external devices, expansion boards, and networking peripherals. 7. Security Features: To ensure the integrity and protection of sensitive data, the XCZU19EG-2FFVB1517E incorporates robust security features such as secure boot functionality, encrypted bitstream support, and secure key storage. These features help safeguard the system against possible security threats. 8. Integrated Analog: The IC integrates analog components, which include a 12-bit Analog-to-Digital Converter (ADC) and a 12-bit Digital-to-Analog Converter (DAC). These analog components allow the IC to interface with the analog domain, broadening its application possibilities. 9. Development Environment: Xilinx provides a comprehensive development environment for the XCZU19EG-2FFVB1517E consisting of the Vivado Design Suite and the Vitis unified software platform. These tools simplify the design, implementation, and verification process, reducing time-to-market. Overall, the XCZU19EG-2FFVB1517E offers a powerful and flexible solution for high-performance computing and programmable system integration. With its advanced features and extensive development support, this IC caters to a wide range of applications, including embedded vision, industrial automation, telecommunications, networking, and many more.

In Stock: 833

MOQ
1PCS
Packaging
1517-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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Payment
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