XCZU17EG-2FFVD1760I

IC SOC CORTEX-A53 1760FCBGA
part number has RoHS
1 : $20747.5000

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Dasenic Part Number
2A36E9-DS
Manufacturer
Manufacturer Part #
XCZU17EG-2FFVD1760I

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1420 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1760-BBGA, FCBGA Tray
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)System On Chip(SoC)
Product StatusActive
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1760-BBGA, FCBGA
Supplier Device Package1760-FCBGA (42.5x42.5)
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
Number of I/ O308
Speed533MHz, 600MHz, 1.3GHz
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
R A M Size256KB
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary AttributesZynq®UltraScale+™ FPGA, 926K+ Logic Cells
SeriesZynq® UltraScale+™ MPSoC EG
Base Product NumberXCZU17
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating4 (72 Hours)
REACH StatusREACH Unaffected
US ECCN5A002A4 XIL
HTS US8542.39.0001
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XCZU17EG-2FFVD1760I is a highly advanced and powerful IC (integrated circuit) component manufactured by Xilinx. It belongs to the Zynq UltraScale+ MPSoC (Multiprocessor System on Chip) family and is specifically designed for high-performance applications. With numerous remarkable features and capabilities, it serves as an essential component in various fields such as aerospace, automotive, networking, and more. 1. UltraScale+ Architecture: The XCZU17EG-2FFVD1760I utilizes Xilinx's UltraScale+ architecture, which combines the power of programmable logic and embedded processing. This integration allows for greater flexibility, efficiency, and scalability in system design. 2. Processing System: It incorporates a quad-core ARM Cortex-A53 processor, which provides high-speed processing capabilities for running complex algorithms and applications. Additionally, it includes dual-core ARM Cortex-R5 processors, mainly used for real-time processing and system management tasks. 3. Programmable Logic: The IC component boasts a significant amount of programmable logic, which allows customization and implementation of specific functionalities required for a given application. It features up to 1.2 million logic cells, making it highly adaptable to a wide range of designs. 4. FPGA Fabric: The FPGA (Field-Programmable Gate Array) fabric in the XCZU17EG-2FFVD1760I offers impressive capabilities for implementing custom digital logic circuits. It provides high-speed data processing, efficient parallelism, and supports a variety of high-level languages for design implementation. 5. High-Speed Interconnect: The component features high-speed interfaces, including up to 48 multi-gigabit transceivers capable of speeds up to 32 Gbps. These transceivers support various protocols such as PCI Express, SATA, USB, and Ethernet, facilitating seamless data transfer between different devices. 6. Memory Interfaces: It offers various interfaces for different types of memories, including DDR4, DDR4 ECC, NAND Flash, NOR Flash, and Quad-SPI Flash. These interfaces allow for efficient storage and retrieval of data, ensuring optimal performance in data-intensive applications. 7. I/O and Peripheral Interfaces: The XCZU17EG-2FFVD1760I offers a wide range of I/O and peripheral interfaces, providing seamless connectivity to external devices. It includes interfaces like UART, I2C, SPI, CAN, GPIO, and more, enabling seamless communication with sensors, actuators, and other external components. 8. High-Level Security: This IC component incorporates advanced security features to safeguard sensitive data and systems. It includes a dedicated security processing unit, secure boot, encrypted programming bitstreams, and various security protocols, offering protection against unauthorized access and attacks. 9. Power Management: The component features efficient power management capabilities to optimize power consumption and extend battery life in portable and low-power applications. It integrates multiple power domains and advanced power management techniques, allowing dynamic power scaling based on system requirements. 10. Development Tools: Xilinx provides comprehensive development tools, including Vivado Design Suite, Software Development Kit (SDK), and PetaLinux, to support the design, simulation, implementation, and debugging of systems using the XCZU17EG-2FFVD1760I. In summary, the XCZU17EG-2FFVD1760I is a highly versatile and advanced IC component with its UltraScale+ architecture, powerful processing capabilities, extensive programmable logic, high-speed interfaces, and comprehensive development tools. It is suitable for a wide range of applications requiring high performance, flexibility, and reliability.

In Stock: 1420

MOQ
1PCS
Packaging
1760-BBGA, FCBGA Tray
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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Payment
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