XCVU065-2FFVC1517I

IC FPGA 520 I/O 1517FCBGA
part number has RoHS
1 : $22940.0000

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Dasenic Part Number
40DBF6-DS
Manufacturer
Manufacturer Part #
XCVU065-2FFVC1517I

Customer Reference

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2684 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
1517-BBGA, FCBGA
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Operating Temperature-40??C ~ 100??C (TJ)
Mounting TypeSurface Mount
Package / Case1517-BBGA, FCBGA
Supplier Device Package1517-FCBGA (40x40)
Number of I/ O520
Number of L A Bs/ C L Bs44760
Number of Logic Elements/ Cells783300
Total R A M Bits45363200
Voltage Supply0.922V ~ 0.979V

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The IC component XCVU065-2FFVC1517I is a highly advanced programmable logic device developed by Xilinx. It belongs to the Virtex UltraScale+ family and is designed to cater to the needs of complex and high-performance applications in various industries. The XCVU065-2FFVC1517I features a field-programmable gate array (FPGA) architecture, which enables users to configure the device according to their specific requirements. The FPGA is based on the 16nm FinFET+ process technology, ensuring enhanced performance, lower power consumption, and improved reliability. Key features of the XCVU065-2FFVC1517I include: 1. UltraScale+ Architecture: This IC component leverages the UltraScale+ architecture, which combines high-performance processing capabilities with advanced memory and I/O technologies. It allows for accelerated system performance and increased logic density. 2. High Logic Density: With a device capacity of 1,143,000 logic cells, the XCVU065-2FFVC1517I offers ample space for implementing complex designs. Users can integrate a large number of digital functions or algorithms into a single device. 3. Enhanced DSP Performance: The component includes 6,840 DSP slices, which provide extensive digital signal processing capabilities. This allows for efficient implementation of high-performance filters, image processing algorithms, math functions, and more

In Stock: 2684

MOQ
1PCS
Packaging
1517-BBGA, FCBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 9999.999999
Total
$ 10000

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
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