XCV600-5FG676C

IC FPGA 444 I/O 676FCBGA
part number has RoHS
1 : $0.0000

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Dasenic Part Number
54426E-DS
Manufacturer
Manufacturer Part #
XCV600-5FG676C

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90 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
676-BGA

Quantity

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ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature0°C ~ 85°C (TJ)
Mounting TypeSurface Mount
Package / Case676-BBGA, FCBGA
Supplier Device Package676-FCBGA (27x27)
Voltage - Supply2.375V ~ 2.625V
Number of Gates661111
Number of I/ O444
Number of L A Bs/ C L Bs3456
Number of Logic Elements/ Cells15552
Total R A M Bits98304
SeriesVirtex®
PackagingTray

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Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XCV600-5FG676C is a high-performance programmable IC component that belongs to the Xilinx Virtex FPGA family. It offers a range of advanced features and capabilities, making it suitable for a wide range of applications that require high-speed data processing. Key Features of XCV600-5FG676C: 1. FPGA Architecture: The XCV600-5FG676C features a field-programmable gate array (FPGA) architecture. This allows users to configure the device according to their specific requirements, offering flexibility and customization. 2. Generous Logic Capacity: With its 600,000 system gate count, the XCV600-5FG676C offers ample logic capacity for complex designs, making it ideal for applications requiring extensive processing capabilities. 3. High-Speed Interfaces: The component supports a variety of high-speed interfaces, including PCI, RapidIO, and Ethernet. This facilitates seamless integration with other devices and enables efficient data transfer. 4. Integrated Memory: The XCV600-5FG676C includes embedded memory blocks with a capacity of up to 2.1 Mbits. This integrated memory enables efficient data buffering and storage within the device, reducing the need for external memory components. 5. Flexible I/O Configurations: The FPGA provides extensive I/O capabilities, with 660 I/O pins available in the 676-pin BGA package. These I/O pins can be configured as single-ended or differential, offering versatility for different interface requirements

In Stock: 90

MOQ
1PCS
Packaging
676-BGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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