XCV50E-6FG256I

IC FPGA 176 I/O 256FBGA
part number has RoHS
1 : $0.0000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
E7B4B9-DS
Manufacturer
Manufacturer Part #
XCV50E-6FG256I

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

60 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
256-BGA

Quantity

Get pricing info from knowledgeable sales

ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Product StatusObsolete
Operating Temperature-40°C ~ 100°C (TJ)
Mounting TypeSurface Mount
Package / Case256-BGA
Supplier Device Package256-FBGA (17x17)
Voltage - Supply1.71V ~ 1.89V
Number of Gates71693
Number of I/ O176
Number of L A Bs/ C L Bs384
Number of Logic Elements/ Cells1728
Total R A M Bits65536
SeriesVirtex®-E
PackagingTray

Kindly contact our sales Rep to obtain the data you desire for XCV50E-6FG256I.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XCV50E-6FG256I is an integrated circuit (IC) component that boasts powerful features for various applications. This Field-Programmable Gate Array (FPGA) chip, manufactured by the Xilinx Corporation, offers both performance and versatility. Here's an overview of its key features: 1. FPGA Design: The XCV50E-6FG256I is designed to implement custom digital circuitry. It contains a high number of logic blocks, which can be interconnected to create complex digital designs as per specific requirements. 2. Logic Capacity: This IC offers a generous logic capacity, which is ideal for applications that demand substantial digital circuitry. The user can utilize an array of logic elements available on the FPGA to create intricate designs. 3. Gate Density: With a large number of gates per unit area, the XCV50E-6FG256I offers high gate density. This ensures efficient utilization of silicon resources and allows for the implementation of more complex designs in the available FPGA space. 4. I/O Interfaces: The chip provides numerous configurable input/output pins, enabling seamless integration with external devices and peripherals. These interfaces can be tailored to various voltage standards and protocols. 5. High-Speed Performance: The XCV50E-6FG256I delivers excellent performance even when handling complex designs. It supports high-frequency operations, allowing for speedy data processing and rapid system response times

In Stock: 60

MOQ
1PCS
Packaging
256-BGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04