XC6VCX130T-1FFG484C

IC FPGA 240 I/O 484FBGA
part number has RoHS
1 : $2142.4000

First-time registration with orders over $2,000 receives a $100 coupon. Register Now !

Dasenic Part Number
09BADC-DS
Manufacturer
Manufacturer Part #
XC6VCX130T-1FFG484C

Customer Reference

Datasheet
Sample
  • Technical Support
  • Issue An Invoice
  • 365 Days Warranty
  • Fast Refund

2190 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
484-BBGA
Quantity
Unit Price
$ 2142.4
Total
$ 2142.4

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
ManufacturerXilinx®
Integrated Circuits (ICs)Field Programmable Gate Arrays (FPGAs)
Operating Temperature0??C ~ 85??C (TJ)
Mounting TypeSurface Mount
Package / Case484-BBGA
Supplier Device Package484-FBGA (23x23)
Number of I/ O240
Number of L A Bs/ C L Bs10000
Number of Logic Elements/ Cells128000
Total R A M Bits9732096
Voltage Supply0.95V ~ 1.05V

Kindly contact our sales Rep to obtain the data you desire for XC6VCX130T-1FFG484C.
lauren@dasenic.com

Environmental & Export Classifications
EU RoHS StatusRoHS Compliant
REACH StatusVendor is not defined
US ECCNProvided as per user requirements
China RoHS StatusGreen Symbol: Green and environmentally friendly product
Description (v) Features
The XC6VCX130T-1FFG484C is an advanced integrated circuit (IC) component manufactured by Xilinx. This FPGA (Field-Programmable Gate Array) device belongs to the Virtex-6 family and is designed to provide high-performance computing solutions for a wide range of applications. Key Features of the XC6VCX130T-1FFG484C include: 1. FPGA Architecture: Built on a 40nm process technology, this IC offers a powerful and flexible programmable logic architecture capable of implementing complex digital circuits and systems. 2. Logic Cells: The device contains 129,600 logic cells, which are programmable building blocks for implementation of various digital functions. These cells can be interconnected and configured to create custom digital circuits. 3. High-Density Configuration: With a capacity of 130,000 flip-flops, this FPGA enables the implementation of large and highly complex designs, making it suitable for demanding applications that require high computational power. 4. Flexible I/Os: The IC offers a comprehensive range of I/O interfaces, featuring 485 user I/O pins supporting various protocols such as LVCMOS, SSTL, HSTL, and LVDS. These interfaces enable seamless integration with external devices, ensuring efficient data transmission. 5. DSP Slices: The XC6VCX130T-1FFG484C contains 864 dedicated Digital Signal Processing (DSP) slices

In Stock: 2190

MOQ
1PCS
Packaging
484-BBGA
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse
Quantity
Unit Price
$ 2142.4
Total
$ 2142.4

* Tax not included , All prices are in USD

Pricing (USD)

Prices are for reference only and aren't final sales prices.
Delivery
dhlupsfedex
Payment
paypalstripewiretransferpaypal02paypal04