XC17S200APDG8C

IC PROM SER 200K C-TEMP 8-DIP
part number has RoHS
1 : $0.0000

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Dasenic Part Number
524DF7-DS
Manufacturer
Manufacturer Part #
XC17S200APDG8C

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40 In Stock

MOQ
1PCS
Delivery Time
Ship Within 48 Hours
Packaging
8-DIP (0.300", 7.62mm) Tube

Quantity

Get pricing info from knowledgeable sales

ManufacturerXilinx®
Integrated Circuits (ICs)Configuration PROMs for FPGAs
Product StatusObsolete
Operating Temperature0°C ~ 70°C
Mounting TypeThrough Hole
Package / Case8-DIP (0.300", 7.62mm)
Supplier Device Package8-PDIP
Memory Size2Mb
Voltage - Supply3V ~ 3.6V
Programmable TypeOTP
Base Product NumberXC17S200A
PackagingTube

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Environmental & Export Classifications
EU RoHS StatusROHS3 Compliant
MSL Rating1 (Unlimited, 30°C/85%RH)
REACH StatusREACH Unaffected
US ECCNEAR99
HTS US8542.32.0061
China RoHS StatusOrange Symbol: Safe for use during the environmental protection period
Description (v) Features
The XC17S200APDG8C is an IC component, specifically a Field Programmable Gate Array (FPGA), manufactured by Xilinx. This component offers a wide range of features suitable for various applications. Here are some key features of the XC17S200APDG8C: 1. Configuration: The XC17S200APDG8C belongs to the XC1700 family, which utilizes antifuse technology for configuration purposes. Antifuse technology allows permanent programming of the FPGA, providing a non-volatile memory configuration solution. 2. Logic Capacity: This IC component has a logic capacity of 2,400 configurable logic blocks (CLBs). The CLBs consist of Look-Up Tables (LUTs) and flip-flops, offering flexibility in designing complex combinational and sequential logic circuits. 3. I/O Interfaces: The XC17S200APDG8C offers various I/O interfaces, providing connectivity options for external devices. It includes programmable I/O pins that support single-ended or differential signaling, making it compatible with various communication protocols. 4. Memory Resources: This FPGA features on-chip memory resources for storing data. It includes distributed RAM, which allows designers to implement memory structures as needed within the device, and Block SelectRAMs that provide higher density memory blocks. These memory resources are particularly useful for applications that require data buffering or storage capabilities

In Stock: 40

MOQ
1PCS
Packaging
8-DIP (0.300", 7.62mm) Tube
Delivery Time
Ship Within 48 Hours
Shipping Origin
Shenzhen or Hong Kong Warehouse

Quantity

Get pricing info from knowledgeable sales

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